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a d b c g f e through-hole copper foil @? features significant cost reducti on is possible by replacing copper plating through-hole pwb wi th polymer through-hole pwb. high density circuit design is widely available. double sided surface mount pwb is available by using polymer through-hole pwb. highly reliable pwb is realized by using polymer through-holes on paper phenolic board. @? construction @? design requirement @? specification double sided (silver / copper) polymer through hole boar d no. name no. name base solder resist copper foil covercoat & marking through-hole through-hole pitch through-hole pitch:a c d e f g 1.00 0.80 0.20 0.25 0.20 0.20 1.25 1.00 0.25 0.25 0.20 0.20 1.50 1.20 0.30 0.30 0.20 0.20 1.75 1.40 0.35 0.40 0.20 0.20 2.00 1.50 0.50 0.50 0.20 0.20 2.50 2.00 0.50 0.50 0.20 0.20 (mm) agth cuth copper paste through-hole pitch: silver paste copper paste min. 1.25mm 100m initial 1 3 5 solder dipping (260 =? 5sec 5cycle) 0 50 100 150 200 250 through-hole resistance (m 95%rh) 0 50 100 150 200 250 0 250 500 750 1000 time (hr) through-hole resistance (m 95%rh 300ma) 0 50 100 150 200 250 0 250 500 750 1000 time (hr) through-hole resistance (m 95%rh dc50v) a 1.e+07 1.e+08 1.e+09 1.e+10 1.e+11 1.e+12 1.e+13 0 500 1000 1500 2000 time (hr) insulationresistance ( 95%rh dc100v) 1.e+07 1.e+08 1.e+09 1.e+10 1.e+11 1.e+12 1.e+13 0 500 1000 1500 2000 time (hr ) insulationresistance (

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